Method of Manufacturing Conductive Structures

ABSTRACT

The present invention relates to a method of manufacturing a web of a plurality of conductive structures which may be used for example to produce an antenna, electronic circuit, photovoltaic module or the like. The method involved simultaneously patterning at least one pattern in a conductive layer using a plurality of registration marks. The registration marks serve to align and guide the creation of the plurality of conductive structures. Optical brighteners may also be utilized within the adhesive layer and the registration marks of the present invention in order to detect the location where conductive structures are to be placed.

CROSS-REFERENCE TO RELATED APPLICATION

The present application claims the benefit of U.S. ProvisionalApplication Nos. 61/354,380 filed Jun. 14, 2010, 61/354,388 filed Jun.14, 2010, and 61/354,393 filed Jun. 14, 2010, all of which areincorporated herein by reference in their entireties.

FIELD OF THE INVENTION

The present invention relates to the field of conductive assemblies andmethods of making such assemblies. More specifically, the presentinvention relates to a method for producing patterned conductivestructures by laser cutting. The conductive structures may be used inthe production of antennas for RFID circuits, photovoltaic arrangements,reflective assemblies, or other constructions.

BACKGROUND OF THE INVENTION

Conductive laminates such as foil laminates are used in a number ofapplications, ranging from containers for microwave packages to smartcards. Such laminates have regularly been created by die cutting,stamping, and other mechanical processes that generally lend themselveswell to high speed situations in which a relatively simple shape orpattern can be created.

The increased demand for circuits has created a need for a manufacturingmethod that can quickly and efficiently produce such circuits. Once suchmethod is disclosed in U.S. Patent Application No. 2007/0171129 A1. Thismethod includes the steps of providing a reinforced metal foil laminate,having a metal foil layer bonded to a reinforcement layer, and a carrierlayer bonded to the metal foil laminate. The method includes the step ofusing a rotary die cutter to cut an antenna pattern through the metalfoil laminate to the carrier layer. The method concludes by removing anundesired matrix portion of the reinforced metal foil laminate toprovide a metal foil laminate antenna disposed on the carrier layer.

A rotary die cutter has been used to produce various structures becauseit is both fast and inexpensive. However, rotary die cutters have poorresolution and are currently limited to having a minimum distancebetween cut lines of about 1 mm. An additional problem with using arotary die cutter to cut a construction requiring high precision andtolerance is that the cylindrical die used by the rotary die cuttercannot be quickly or easily changed. Accordingly, the design is notreadily changeable, and thus it is often not economically feasible toproduce small batches of a particular design because of the need toconstantly change out die heads. Furthermore, any change in design wouldrequire a large lead-time, as a new cylindrical die must be manufacturedeach time the design is changed. This can create a large inventory ofdie heads, the storage of which can occupy valuable factory floor space.

What is needed, therefore, is an efficient system and method to produceintricate patterns in conductive materials without the foregoingdrawbacks associated with conventional cutting devices.

BRIEF SUMMARY OF THE INVENTION

The embodiments of the present invention described below are notintended to be exhaustive or to limit the invention to the precise formsdisclosed in the following detailed description. Rather, the embodimentsare chosen and described so that others skilled in the art mayappreciate and understand the principles and practices of the presentinvention.

The present invention is directed to using a laser to cut one or morepatterns in a conductive layer to create structures that may besubsequently modified for use in a variety of applications such as withradio frequency identification devices (RFID). An exemplary lasersuitable for use in the present invention includes an ytterbium laser,which pulses at about 48 kHz with a wavelength of approximately 1024 nm.Ideally, the energy of the laser is not apparent from the surface of thesubstrate. This means that the use of the laser does not cause diestrikes, discolorations or any surface roughness.

In the present invention optical brighteners, or other registrationmarks or initiators (collectively referred to as registration marks) maybe utilized in cooperation with an adhesive pattern or layer in order todetermine the placement or position of the registration marks to be usedin the formation of the conductive structures.

In an exemplary embodiment of the present invention, a method isprovided for patterning a plurality of registration marks and patterningsimultaneously a conductive layer over a pre-patterned layer ofadhesive. The registration marks are detected via a laser. Oncedetected, a cutting mechanism is triggered that cuts a pattern orplurality of patterns in the conductive layer in order to form aconductive structure such as an antenna. In an alternate embodiment ofthe foregoing, registration marks can be used to place a microprocessorchip which then in turn can be used by the laser cutter in locating thearea to form the antenna pattern.

In a still further embodiment, a first pattern which may be formed by acold foil process or die cutting and then subsequently finished by alaser cutting more intricate patterns to provide a final pattern.

In one embodiment of the present invention, a conductive intermediateassembly is provided that includes a substrate that has a first andsecond face. A pattern of adhesive is provided on the first face of thesubstrate. A conductive layer, such as a metal foil, is applied over thepattern of adhesive. The conductive layer has at least a first patternformed in the layer with the at least first pattern corresponding to thepattern of adhesive.

The patterns used in connection with practicing the present inventionare formed by laser cutting. The laser cutter is controlled by acomputer and in addition to the foregoing, the computer driven systemmay be used to create marketing or advertising indicia, such as symbols,names, trademarks, logos, manufacturing information, other intricatepatterns and the like. The system can also be used to control a printingor imaging press such as an ink jet or laser printer to provideadditional indicia to the substrate on which the conductive structurehas been formed. Thus, a complete system having a relatively small footprint is provided to generate small batches or quantity of customizedmaterials such as hang tags, tickets, tags and the like.

In another embodiment, a substrate is provided having a first part and asecond part, with a conductive pattern formed by laser cutting providedin the first part and indicia such as a retailer logo or name providedin the second part. The indicia is provided by laser die cutting. Thesubstrate may be provided with first and second portions that may befolded over on one another to form a hang tag, ticket or label.

Other features and advantages of the present invention will becomeapparent to those skilled in the art from the following detaileddescription. It is to be understood, however, that the detaileddescription of the various embodiments and specific examples, whileindicating preferred and other embodiments of the present invention, aregiven by way of illustration and not limitation. Many changes andmodifications within the scope of the present invention may be madewithout departing from the spirit thereof, and the invention includesall such modifications.

BRIEF DESCRIPTION OF THE DRAWINGS

These, as well as other objects and advantages of this invention, willbe more completely understood and appreciated by referring to thefollowing more detailed description of the presently preferred exemplaryembodiments of the invention in conjunction with the accompanyingdrawings, of which:

FIG. 1 depicts a cross-section of the web of the present invention priorto patterning;

FIG. 1A shows an exemplary conductive structure produced in accordancewith the present invention;

FIG. 2 depicts a partial selection of a web after patterning by acutting mechanism having a plurality of conductive laminates disposed onthe surface of the web;

FIG. 3 illustrates a methodology of creating the conductive structuresof the present invention;

FIG. 4 is a schematic showing the process for creating the web depictedin FIG. 1;

FIG. 5 depicts a roll-to-roll process for manufacturing a standardconductive structure in accordance with an aspect of the presentinvention; and

FIG. 6 provides a substrate produced in accordance with the presentinvention.

DETAILED DESCRIPTION OF THE INVENTION

The present invention is now illustrated in greater detail by way of thefollowing detailed description which represents the best presently knownmode of carrying out the invention. However, it should be understoodthat this description is not to be used to limit the present invention,but rather, it is provided for the purpose of illustrating the generalfeatures of the invention.

The present invention relates to a unique and efficient method forproducing intermediate assemblies that may be used in the creation ofintricately formed circuits, antennas, photovoltaic modules, and otherspecialized conductive structures. The present invention provides amethod in which registration marks are utilized for alignment purposesof a laser cutter and a pattern for at least one conductive structuremay be formed in a conductive material. The present invention alsodiscloses the use of optical brighteners as registration marks or inaddition to registration marks to indicate the placement of conductivestructures.

The printing of registration marks and coating of adhesive may alsooccur simultaneously, substantially simultaneously, or sequentially inorder to be able to quickly and efficient produce conductive structuresin accordance with the present invention.

The present invention may also, or in the alternative, use registrationmarks for the placement of a microprocessor chip prior to thecommencement of the laser ablating or cutting (see FIG. 1A). In thisembodiment, the laser can utilize the chip as a registration mark toguide the laser in the cutting of the conductive pattern in the foillayer.

FIG. 1 illustrates a cross-sectional view of the web 10 of the presentinvention. A substrate 11 having a first face 13 and a second face 15has an adhesive layer 20 provided over at least a portion the first face13 of the substrate 11. The adhesive layer 20 in one embodiment isprovided in a pattern which will correspond to the shape of theconductive structure that is to be formed in the foil or conductivelaminate (see FIG. 1A). A conductive layer 120 is then provided over theadhesive layer 20. The conductive or foil layer 120 adheres only tothose areas of the adhesive which are provided in a pattern. That is,portions of the foil layer will not be attached to the substrate, whileother portions, due to the patterning of the adhesive will be adhered tothe substrate. The adhesive pattern can be seen, for example,terminating at line 17 in FIG. 1, such that a portion of the foil 120 isnot adhered to the substrate 11, designated by the non-adhesive area121. An exemplary conductive pattern 50 is shown in FIG. 1A. Theconductive pattern 50 has an area 55 which may be used to attach amicroprocessor chip or strap to the structure formed.

As used herein, the term “conductive layer” may include a foil layer, ora foil combined with one or more additional layers such as a reinforcinglayer, carrier layer, adhesive, cover layer or the like.

The substrate 11 may be made out of any material or combination ofmaterials that allow the substrate 11 to be flexible so as to facilitatethe manufacture of the substrate 11 as a continuous web that can bewound into a roll form for use in a roll-to-roll process (see FIGS. 4and 5). Examples of such substrate materials include, but are notlimited to, polyester films, polyethylene terephthalate films, polyimidefilms, fabric (woven, non-woven, synthetic, natural), cloth or papermaterials (card stock paper, bond paper, recycled paper, etc.).

It should be understood that while the present invention is described asa roll-to-roll arrangement using a web, the invention may be practicedin a sheet feed configuration, where a stack of sheets of material areused as the supply of starting material.

The conductive layer 120 may be made out of any suitable conductivematerial, such as aluminum, copper, silver, gold, alloys of metals andthe like. Combinations of conductive materials may be used. In additionthe conductive material may be created by printing conductive ink,etching, or other suitable processes.

The adhesive layer may be a general-purpose permanent pressure-sensitiveadhesive, pressure-activated adhesive, or other suitable adhesive. Theadhesive layer may be applied to the substrate through pattern coatingor printing, such as with ink jet, flexographic printing, full coating,or other suitable method.

Reference is now directed to FIG. 2 which shows a web 10 of the presentinvention after patterning by a cutting mechanism, such as a laser. Aweb 10 is provided having a number of conductive structures 22 providedon the upper surface 12 of the web 10, once the remaining matrix, theunconnected portions of the conductive foil, has been stripped away. Inorder to form the conductive structure 22, the web 10 was provided witha series of printed registration marks 14 along one of the first andsecond longitudinally extending side edges 16 and 18 of the web 10 ontop of the adhesive (not shown). It should be understood thatregistration marks may be provided along both sides or edges of thesubstrate, or in other positions of the substrate.

The registration marks 14 may also be provided in one embodiment on thefirst face 13 of the substrate 11 prior to the coating of the adhesiveon the first face 13 of the substrate 11 as long as a transparent coatof adhesive is used so as to allow for detection of the registrationmarks 14. That is, the transparent coating, if it is applied over themarks, would allow the marks to be visible, such as by a machine visionsystem scanning, through the coating. The registration marks 14 assistin alignment of the conductive structures 22 and are patterned by aprinter. Typically, registration marks 14 are provided in a machinedirection, that is the direction the web or sheet travels through themachine. The registration marks may be provided with optical brightenersin order to facilitate detection of the marks.

FIG. 3 provides a block diagram for an exemplary method for creating aplurality of conductive structures 22 on a web 10 of the presentinvention by applying a plurality of registration marks 14 and at leastone conductive pattern 24. In step 300, a substrate 11 is provided thathas first and second faces. An adhesive layer 20 (shown in phantom anduncovered by the conductive layer 22 for illustration purposes) isprovided over the first face 13 of the substrate 11. A layer of adhesive20 is provided over the substrate 11 first face 13 either in a patterncorresponding to the structures to be formed or alternatively, floodcoated. A series of registration marks are also printed on the substratefirst face. A conductive layer 120 (see FIG. 1) is provided over theadhesive layer 20.

In one embodiment where the adhesive is flood coated on the substrateand not provide in specific patterns, the areas of the adhesivecorresponding to the patterns to be formed are deadened at step 310where conductive structures are not to be formed. In step 301, certainareas of the adhesive layer are “deadened,” by a UV source or a printvarnish (not shown). As a result, the adhesive layer 20 will haveseparate areas designated as “dead” and “active.” An active area ofadhesive will retain its tackiness and allow the conductive or foillayer to stick to the adhesive, whereas a deadened area loses itstackiness and the foil or conductive layer will not adhere to theadhesive. By deadening certain areas of the adhesive layer 20, namely,those areas 21 around the locations where the conductive structures 22are to be formed by the active areas of the adhesive layer 20 will besubstantially surrounded by deadened adhesive. A cutting tool is used tocut the patterns 24 in the conductive layer 120 for a conductivestructure 22. In a preferred embodiment, the cutting mechanism is alaser. It should be understood however, that the cutting pattern 24 canbe accomplished by using other cutting devices, which may pre-cut aportion of the pattern prior to cutting by the laser of the moreintricate patterns.

At step 320 the conductive layer is laminated or adhered to thoseportions of the adhesive that remain tacky. At step 330, a plurality ofpatterns are cut in the adhesive layer to form a plurality of conductivestructures.

The excess material of the conductive layer 120 that is provided overthe deadened areas of the adhesive layer 20 is removed by stripping theremaining matrix from the conductive layer 120 from the deadened areasof the adhesive layer 20. It should be pointed out that the matrix,particularly if a metal foil is used, is 100% recyclable. In anotherembodiment, the adhesive may be patterned onto the first face 13 of thesubstrate 11, which means that a plurality of geometrical shapes arepatterned onto the first face of the substrate, or that specifiedportions of the first face of the substrate are covered with adhesivewherein other portions of the first face of the substrate are notcovered with adhesive. By patterning the adhesive onto the first face 13of the substrate 11, deadening of certain areas of the adhesive with aUV source or print varnish is unnecessary.

In an embodiment of the present invention, optical brighteners 23 incooperation with registration marks are utilized in order to trigger thecutting mechanism to cut at least one pattern 24 in the conductive layer120 for a conductive structure 22. Optical brighteners 23 may beprovided in or around the area of the registration marks 14, that isalong the marginal or side areas to trigger the laser to begin cuttingthe conductive substrates. In one embodiment, optical brighteners 23 maybe mixed in the pattern of adhesive layer 20. In another embodiment apattern of optical brighteners 23 may also be printed on top of patternof adhesive layer 20 rather than being mixed in the adhesive layer 20itself. In another embodiment, a specific pattern of optical brighteners23 may be printed on the first face 13 of the substrate 11 prior to theadhesive layer 20 being provided over the first face 13 of the substrate11 then a clear or at least a partially transparent adhesive is appliedover the substrate so that the optical brighteners 23 are visiblethrough the adhesive layer 20 and may be recognized the cuttingapparatus.

Additional optical brighteners 23 may also be provided in a particularshape or around the area where the conductive structure 22 to be formed,so that supplemental laser cutting can take place such as the cutting ofareas to form the chip attachment or placement portion.

The optical brighteners 23 may be provided in a specified pattern suchas columns and/or rows in certain geometric shapes in order to triggerthe cutting mechanism to cut a pattern at each location of an opticalbrightener registration mark for a conductive structure 22 in theconductive layer 120. The conductive layer 120 when laid over theadhesive layer 20 does not cover the area occupied by the registrationmarks 14 and/or optical brighteners 23 so as to allow the cuttingmechanism to detect the registration marks in order to align theplurality of conductive structures with the registration marks. When theoptical brighteners 23 are used as registration marks 14, it is possibleto pattern the adhesive 20 and the registration marks 14 simultaneouslythereby providing a more efficient method by reducing the number ofsteps needed for constructing conductive structures.

The registration marks 14 may be printed using a wide variety of inks ontop of the individual optical brighteners 23. In an alternativeembodiment, the registration marks 14 of the present invention, may alsobe created from portions of the conductive layer or fragments of foillaminate which are positioned in a particular area to be detected by thecutting device.

In an exemplary embodiment, the optical brighteners 23 are a fluorescentpowder, of approximately 1% of the total weight of the pattern ofadhesive and more preferably the fluorescent powder comprises 0.5% thetotal weight of the adhesive. The optical brighteners 23 and theadhesive layer 20 may be created from the same printing plates andblanket in order for the optical brighteners 23 and the pattern ofadhesive 20 to be generated simultaneously. In other embodiments of thepresent invention, the optical brighteners 23 may be a select color offluorescent powder or may include UV detectable elements.

The conductive layer 120 has at least one pattern 24 corresponding to atleast a portion of the adhesive layer 20. The present inventioncontemplates the possibility of a plurality of patterns, that ispatterns produced in single or multiple lanes. The cutting mechanism canbe used to create an additional area for the attachment of integratedcircuit, and finish cutting of additional patterns so as to add somevariability to the design. With respect to placement of the chip, strapscan be placed on the foil having to facilitate alignment of the chip sothat it can be more readily connected to an attachment point. Theattachment pattern 24 is approximately 100 micron wide.

In another embodiment, a further pattern may be produced in another areaof the conductive layer to form a bar code, logo of a company, or someother variable data or indicia.

Attention is now directed to FIG. 4 which provides a possible schematicfor producing the web 10 as illustrated in FIG. 1. The web of material,such as paper, plastic, cloth or fabric, is unwound from a roller 30. Aprinter 32 can be used to apply registration marks to the web forsubsequent scanning by the adhesive coating and cutting stations. Anadhesive applicator 34 applies the adhesive layer which may havedistinct adhesive patterns 20 that will correspond to the conductivestructures or the adhesive may be applied as a full coat of the web.Next, where the adhesive layer has been applied as full coat or floodcoated, a UV source 36 is directed over the adhesive to deaden selectareas of the adhesive, those areas outside the areas corresponding tothe patterns to be created in the conductive layer, leaving active areaswhere the conductive structures 22 will be formed. A roller 40 laminatesa conductive layer 38 such as a foil which is fed from unwind 37 sourceto the active areas of the adhesive coated web 10. A pattern 24 is cutvia a laser cutter 42 in the conductive layer. It should be noted thatthe energy from the laser does not score or mark the underlyingsubstrate web.

In an alternative embodiment, a first cut pattern can be produced in thefoil layer such as by a rotary die cutter or through a cold foilprocess. As used herein an exemplary cold foil process refers toprinting an adhesive or other curable pattern onto a substrate thenapplying a foil layer over the pattern, laminating the foil to thepattern so that the foil sticks to the pattern and then stripping awaythe foil, leaving the pattern on the substrate covered with the foillayer. The cold foil process can occur either before or after the finalcutting by the laser cutter.

Once the pattern 24 is cut into the conductive layer or foil 38, theremaining portions of the conductive layer that are not in contact withthe active areas of the adhesive layer is stripped off by a stripper 44and rewound 46. The collected material, for example foil, is 100%recyclable as the foil has not been contaminated with the adhesive asthe adhesive has been deadened prior to application or, if patternedadhesive was used, not applied. The web 10 is then wound at 48. The web10 after forming the individual conductive structure or foil laminates22 may be sent through a cutter (not shown) to separate the individualconductive structures or foil laminates from one another or the web maybe collected and cut at a later date. The web 10 may also undergo asecond or third or more cutting depending on the particular end use tobe made of the conductive substrate.

The laser cutter 42 may also cut indicia into the foil such astrademarks, trade names, logos or other information in a separate areaso as to add some variability and personalization to the web as will bedescribed herein.

A further schematic illustration of a roll to roll process by which aweb 10 of conductive structures 22 may be created is illustrated in FIG.5. A web 90 is dispensed via an unwinder 95 from a web roll 100 and fedto a first cutting stating, e.g. a laser, rotary cutter or cold foilroller or die 100 which has a rotary die 150 if the station is a diecutting or cold foil unit. The first cutter may be used to remove largesegments of material from the conductive structure to be formed. The web90 exits a first cutter 110, and is fed into a laser cutter 175. A lasercutting path 215 is programmed into a computer 177 that controls thelaser cutter 175. The computer controlled laser cutter can perform allthe cutting that is necessary or it may alternatively be reserved forcutting more intricate patterns or for any finishing cutting.

Continuing with FIG. 5, the web 155 exits the laser cutter 175 and isfed into a stripper 180, if necessary. When provided, the stripper 180separates the matrix web or remaining conductive material or foil 190from the formed conductive structures 22 to create a conductivestructure web 185. The conductive structure web 185 has a succession ofstructures 22 disposed on a carrier layer 185. The conductive structureweb 185 is wound into a roll 195 by a first rewinder 200, while thematrix web 190 is wound into a matrix roll 210 by a second rewinder 205.

Reference is now directed to FIG. 6, which includes a substrate 400,having a first part 410 and a second part 420. The first part 410 isprovided with a conductive structure 430 such as an RFID antenna/deviceand the second part 420 is provided with indicia 440 such as a retailername, logo or other information such as trademarks, trade names,designs, patterns or the like. Each of the conductive structure 430 andindicia is produced by laser cutting.

The substrate 400 may also include first and second portions 440, 450,respectively. The first portion 440 is made up of the first and secondparts 410, 420, respectively, and the second portion 450 may be foldedover the first portion 440 along a fold line 455 to form one of a hangtag, ticket, label or the like. The second portion 450 may also beprovided with indicia 460 which may relate to the consumer item to whichthe substrate as a hang tag for example is attached.

It will thus be seen according to the present invention a highlyadvantageous method of manufacturing a conductive substrate has beenprovided. While the invention has been described in connection with whatis presently considered to be the most practical and preferredembodiment, it will be apparent to those of ordinary skill in the artthat the invention is not to be limited to the disclosed embodiment, andthat many modifications and equivalent arrangements may be made thereofwithin the scope of the invention, which scope is to be accorded thebroadest interpretation of the appended claims so as to encompass allequivalent structures and products.

The inventors hereby state their intent to rely on the Doctrine ofEquivalents to determine and assess the reasonably fair scope of theirinvention as it pertains to any apparatus, system, method or article notmaterially departing from but outside the literal scope of the inventionas set out in the following claims.

1. A method of making a web of conductive structures: providing asubstrate having first and second faces; providing an adhesive layerover the first face of the substrate; deadening areas of the adhesivelayer to create active areas where adhesive is tacking and deadenedareas where the adhesive is non-tacky; laminating the conductive layerover the adhesive layer such that the conductive layer adheres to theadhesive layer in areas corresponding to the active areas of theadhesive layer; and patterning a plurality of registration marks on theadhesive layer and detecting the registration marks; and cutting theconductive layer to form a plurality of conductive structures.
 2. Themethod of claim 1, wherein the adhesive layer includes a plurality ofoptical brighteners.
 3. The method of claim 1, wherein the registrationmarks include optical brighteners.
 4. The method of claim 1, including afurther step of creating variable or personalized patterns in theconductive layer.
 5. The method of claim 1, wherein the conductivestructures are formed by one of a laser cutter or cold foil process. 6.A method of producing a web having a plurality of RFID antennas:providing a substrate having first and second faces; applying anadhesive layer; printing on at least a portion of the first face of thesubstrate at least one area including an optical brightener; providing acutting mechanism; placing a conductive layer over the adhesive layer;laminating the conductive layer over the adhesive layer such that theconductive layer adheres to active areas of the adhesive layer and doesnot adhere to deadened areas of the adhesive layer; detecting theoptical brightener; and creating at least one pattern for a conductivestructure in the conductive layer.
 7. The method of claim 6, wherein thecreating is done by one of laser cutting, die cutting or cold foilprocess.
 8. The method of claim 6, wherein the optical brightener isincluded with the adhesive layer.
 9. The method of claim 6, wherein theoptical brightener is UV detectable.
 10. The method of claim 6, whereinthe registration marks are printed along edges of the substrate on oneof the first and second faces.
 11. The method of claim 6, wherein areinforcement layer is provided over the layer of adhesive.
 12. Themethod of claim 11, wherein a second adhesive layer is provided over thereinforcement layer.
 13. The method of claim 6, including a further stepof removing portions of the conductive layer not adhered to thesubstrate.
 14. The method of claim 6, including a further step ofcreating variable or personalized patterns in the conductive layer. 15.A web of conductive structures comprising: a substrate having first andsecond faces; a layer of adhesive; at least one registration markprovided one the substrate first face, the at least one registrationmark is provided with an optical brightener; a conductive layer providedover the layer of adhesive; at least one conductive structure formed bylaser cutting of the conductive layer; and wherein the at least oneconductive structure is aligned with the at least one registration mark.16. The web of claim 15, including a pattern of variable or personalizedpatterns formed by laser cutting a pattern in the conductive layer. 17.The web of claim 15, wherein the optical brighteners are provided on topof the layer of adhesive.
 18. The web of claim 15, wherein theconductive structures are antennas.
 19. The web of claim 16, wherein thepattern of variable or personalized information is separate from theconductive structures.
 20. A substrate having a conductive structure,comprising; a substrate having first and second parts; a conductivepattern provided in the first part, the conductive pattern formed bylaser die cutting; and indicia provided on the second part, the indiciaformed by laser die cutting.
 21. A substrate as provided in claim 20,wherein the substrate includes first and second portion, with the firstportion having the indicia and conductive pattern and the second portionincluding a blank area for folding over the first portion to form one ofa hang tag, ticket or label.